![]() The system was pres- surized until the workpiece failed, a predetermined pressure was reached, or the seal in the die failed resulting in loss of hydraulic pressure. The workpieces were placed in the tooling and a clamping load was applied. The material properties, obtained by microscale tensile testing, are summarized in Table 1. ![]() The workpieces used for the tests were annealed ASTM 304 stainless steel, 25 mm 2 and 0.2 mm thick. A schematic of the tooling is shown in Figure 5. The hydroforming press included the forming dies, pressure gauges and transducers, a linear variable differential transformer (LVDT), a pressure intensifier, and a manifold. Once a workpiece was gridded, it was placed in the table-top sheet hydroforming press with an 11-, 5-, or 1-mm-diameter die. A photograph of the pillars of SU-8 is shown in Figure 3, and an electrochemically etched grid on a workpiece is seen in Figure 4. While the process appears cumbersome, it lends itself to batch production of the workpieces in relatively large quantities. The depth of the etched grids is 2 m m and is highly dependent upon the duration of the etching, the magnitude of the current, etchant type and concentration, height of the mask, and material being etched. These pillars acted as the mask that was used to produce the electrochemically etched grids on each workpiece and were removed chemically after the electrochemical etching of a grid on the workpiece. The workpiece was then developed, and the unexposed SU-8 was chemically removed from the workpiece leaving pillars of exposed and developed SU-8. The SEM grids are manufactured with accuracies of 1.5 m m across the entire grid. A nickel SEM locator grid manufactured by PELCO, 24 3.5 mm in diameter with a pitch of 127 m m, was used as a mask while exposing the SU-8 to ultraviolet light (see Figure 2). 23 A 40- m m-thick layer of SU-8 was applied to the 0.2-mm-thick annealed ASTM 304 workpiece by spin coating, soft baked, and cured overnight. SU- 8 is an epoxy-based negative photoresist manufactured by MicroChem. developed a microscale lithographic mask that was suitable for electrochemical etching. The ‘‘Results’’ section presents an error analysis for undeformed grids as well as an error analysis for strains as a function of pressure for hydrostatic bulging dies with diameters of 11, 5, and 1 mm. 5 A brief summary of the grid marking process is presented, followed by a description of the method used for strain measurement. 22 This research article evaluates microscale strain measurement during hydrostatic bulge testing using the strain grid marking process described by Emblom et al. Finer grids (1–10 m m) have been produced but required using scanning electron microscopes (SEMs) to produce lithographic images with very small pitches and limited fields. Furthermore, their methods utilized relatively advanced equipment to produce the grids, and an analysis of the accuracy of the grid manufacturing and strain measurement processes was not described. Wagner and Camelio’s 21 method resulted in robust circle grids when subjected to high strains but the circles were irregular. The grids were then electrochemically etched on to the workpiece. The photoresist material was then developed and processed so that only dark circles remained on the workpiece. They used a 100- m m circle pattern that was 25 mm 3 25 mm while exposing a photoresist material that had been applied to their workpiece. Wagner and Camelio 21 while performing microscale deep drawing experiments also used microscale photolithography. However, the grids can separate from workpiece when subjected to high strains. A laser- etched mask was developed and used to produce microscale circle grids. 20 while investigating size effects and grain structure performed microscale dome testing used photolithography to generate microscale grids. 20 and Wagner and Camelio, 21 have developed microscale strain grid techniques as alternatives to DIC. While there has been extensive work on the microscale using DIC, several researchers, including Shuaib et al. 19 used an ion etching process on a silicon tensile specimen. gold through a copper mesh on to an aluminum tensile test specimen, and Banks-Sills et al.
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